Ufs Bga: 254 Datasheet

| Ball Group | Pin Count | Description | |------------|-----------|-------------| | VCC (Main Supply) | ~20-30 balls (distributed) | 2.5V or 3.3V – core and NAND supply. Requires low-ESR decoupling caps. | | VCCQ (Controller I/O) | ~12-18 balls | 1.2V or 1.8V – interface logic and reference. | | VCCQ2 (Optional) | ~6-10 balls | 1.8V – for high-speed M-PHY. | | VSS (Ground) | ~60-80 balls | Multiple ground balls to reduce loop inductance. Critical for signal integrity. | | REF_CLK | 2 balls | Differential reference clock input (26MHz or 19.2MHz typical). | | UFS_D0_P / UFS_D0_N | 2 balls | Lane 0 differential pair (TX and RX shared). | | UFS_D1_P / UFS_D1_N | 2 balls | Lane 1 differential pair (optional for dual-lane mode). | | RST_N | 1 ball | Active-low hardware reset. Must be pulled high externally. | | CMD (Boot LUN) | 1 ball | Boot-specific control (varies by vendor). | | NC / RFU | ~40-60 balls | No Connect or Reserved for Future Use. Do not route to these. |

The state is a standout feature of the UFS architecture. It allows the high-speed MIPI M-PHY interface to enter a deep sleep while retaining the configuration state of the controller, allowing the system to wake up almost instantly when data is requested. Diagnostic and Life-Cycle Monitoring

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: Supports Native Command Queuing (NCQ) to optimize execution order. Topology : Point-to-point synchronous serial interface. 2. Ball Matrix and Mechanical Dimensions

Integrating a UFS BGA 254 IC into a printed circuit board (PCB) demands rigorous high-speed layout methodologies. Because the interface relies on low-voltage differential signaling operating at gigabit speeds, minor layout deviations can cause data corruption or failure to boot. Impedance Matching | Ball Group | Pin Count | Description

Core voltage supply for the NAND flash memory arrays (typically 2.5V or 3.3V).

The UFS BGA 254 package is a compact, surface-mount package with 254 solder balls arranged in a grid pattern on the bottom side of the package. The package measures 12mm x 8mm in size, making it suitable for use in small form factor devices. | | VCCQ2 (Optional) | ~6-10 balls | 1

The physical package type. It features an array of 254 solder balls arranged on the underside of the chip, maximizing signal density while minimizing the physical footprint on the printed circuit board (PCB). Key Applications Flagship and mid-range smartphones